130 nm process

Semiconductor
device
fabrication
MOSFET scaling
(process nodes)
  • 020 µm – 1968
  • 010 µm – 1971
  • 006 µm – 1974
  • 003 µm – 1977
  •  1.5 µm – 1981
  • 001 µm – 1984
  • 800 nm – 1987
  • 600 nm – 1990
  • 350 nm – 1993
  • 250 nm – 1996
  • 180 nm – 1999
  • 130 nm – 2001
  • 090 nm – 2003
  • 065 nm – 2005
  • 045 nm – 2007
  • 032 nm – 2009
  • 028 nm – 2010
  • 022 nm – 2012
  • 014 nm – 2014
  • 010 nm – 2016
  • 007 nm – 2018
  • 005 nm – 2020
  • 003 nm – 2022
Future
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The 130 nanometer (130 nm) process is a level of semiconductor process technology that was reached in the 2000–2001 timeframe by such leading semiconductor companies as Intel, Texas Instruments, IBM, and TSMC.

The origin of the 130 nm value is historical, as it reflects a trend of 70% scaling every 2–3 years. The naming is formally determined by the International Technology Roadmap for Semiconductors (ITRS).

Some of the first CPUs manufactured with this process include Intel Tualatin family of Pentium III processors.

Processors using 130 nm manufacturing technology

References

  1. ^ Микропроцессор Эльбрус/МЦСТ. Mcst.ru (in Russian). Retrieved 2015-09-10.
  2. ^ "Микропроцессор МЦСТ R500S/МЦСТ". Mcst.ru (in Russian). Archived from the original on 2015-11-01. Retrieved 2015-09-10.
  3. ^ "CPU from DM&P". Dmp.com.tw. Retrieved 2015-09-10.
Preceded by
180 nm
CMOS manufacturing processes Succeeded by
90 nm
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